Tighter restrictions on DUV litho; Arm-IBM dual-architecture deal; power device trio; Intel takes full control of Irish fab; 1.4nm AI chip; data center heat islands; 300mm fab equipment spending; 67k IC jobs unfilled; HBF wins over GPU; NIST’s photonic chip packaging; USC’s new memory; virtual process simulation for automotive. IBM and Arm are collaborating on a new dual‑architecture hardware aime...