Intel’s expansion; Cadence AI super agent for PCB, advanced packaging; photonics fab wars; earlier Yongin fab; German funding; new CHIPS Act award; HBM standard; Quadric funding; AMS acquisition; earnings; Rapidus teams up. Fig. 1: Chip concept of a super agent for PCB and advanced packaging. Source: Cadence Fig. 2: Hideaki Okamoto, director of new generation business development at Mitsubishi Che...